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| CXA2640ER 3-Channel 2-LD Driver for Optical Disc Drive Description The CXA2640ER is a laser driver IC capable of driving two high output lasers (CD/DVD) for writeable optical discs. Features * CD maximum drive current: 300mA DVD maximum drive current: 250mA * Capable of generating three-value write waveform through control of one read channel and two write channels * Rise/Fall times = 1ns * Read Channel: x100 * Write Channel: x840 (CD), x400 (DVD) * Read channel has extensive low-noise design 1.5nA/Hz (@20MHz, ILD = 35mA, IMOD = 40mAp-p) * Internal high frequency modulator circuit Frequency variable range: 200 to 600MHz Maximum modulator current amplitude: 100mAp-p Can be set separately for CD and DVD. * Timing input for generating write waveform can be adapted to both differential input (LVDS/LVPECL) and single end input (3.3V CMOS/TTL). * Single 5V power supply Applications CD-R, CD-RW, DVD-R, DVD+RW, DVD-RW and DVD-RAM for high-speed writeable optical disc drives Structure Bipolar silicon monolithic IC 24 pin VQFN (Plastic) Absolute Maximum Ratings (Ta = 25C) * Supply voltage Vcc 5.5 * Storage temperature Tstg -65 to +150 * Allowable power dissipation PD TBD Operating Conditions * Supply voltage Vcc * Operating temperature Topr V C 4.5 to 5.5 -10 to +75 V C Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E02223A3Z CXA2640ER Block Diagram and Pin Configuration OUTENREF xOUTEN3 xOUTEN2 OUTEN3 6 5 4 3 2 IIN1 7 OSC LOGIC CONT IIN2 8 Iref IIN3 9 Iref Iref Vcc1 10 Vcc1 Iref VBG Vcc2 11 Vcc2 Vcc_LD Vref RAMP1 (DVD) RAMP2 (CD) RFREQ1 (DVD) RFREQ2 (CD) OUTEN2 VBG 1 GND1 24 GND1 23 OSCEN 22 LDEN2 21 LDEN1 GND2 Vcc_LD 20 GND2 LDOUT2 12 CD side IIN1: x100 IIN2, 3: x840 19 LDOUT1 Vcc_LD 14 R FREQ2 DVD side IIN1: x100 IIN2, 3: x400 13 R FREQ1 15 R FREQ COMP 16 Vcc_LD 17 RAMP1 18 RAMP2 -2- CXA2640ER Pin Description Pin No. 1 2 3 4 Symbol OUTEN2 xOUTEN2 OUTEN3 xOUTEN3 I/O I I -- I I -- 1 2 3 4 2k Pin voltage DC AC Equivalent circuit Description IIN2 set current control signal input. (positive logic) 300 IIN2 set current control signal input. (negative logic) IIN3 set current control signal input. (positive logic) IIN3 set current control signal input. (negative logic) 5 5 OUTENREF O 1.65V -- 40k 300 Reference voltage output for current control signal. Connects decoupling capacitance to ground. 6 6 VBG O 1.26V -- 12.6k 300 Internal reference voltage decoupling. 7 IIN1 I -- -- 100 7 700 Current setting 1. The set current x100 is output when LDEN1 or LDEN2 = high. 8 IIN2 I -- -- 500 8 9 1k Current setting pin 2. The set current x400 is output through LDOUT1 when LDEN1 = high. The set current x840 is output through LDOUT2 when LDEN2 = high. Current setting pin 3. The set current x400 is output through LDOUT1 when LDEN1 = high. The set current x840 is output through LDOUT2 when LDEN2 = high. Supply voltage for control system and modulator system. Supply voltage for timing system and current switch. 9 IIN3 I 10 11 Vcc1 Vcc2 I I -- -- -- -- -3- -- -- CXA2640ER Pin No. Symbol I/O Pin voltage DC AC Equivalent circuit Description 12 LDOUT2 O -- -- 12 CD laser drive current output. Enabled when LDEN2 = high. 13 R FREQ1 O -- -- 300 13 14 8p Modulator frequency setting 1. Enabled when LDEN1 = high. Connects resistance to ground. Modulator frequency setting 2. Enabled when LDEN2 = high. Connects resistance to ground. 14 R FREQ2 O 15 R FREQ COMP O 300 -- -- 15 8p Modulator frequency variation adjustment. Connects resistance to ground. 16 Vcc_LD -- -- -- -- Output stage supply voltage. Modulator amplitude setting 1. Enabled when LDEN1 = high. Connects resistance to ground. Modulator amplitude setting 2. Enabled when LDEN2 = high. Connects resistance to ground. 17 RAMP1 O 300 17 18 8p 18 RAMP2 O 19 LDOUT1 O 19 DVD laser drive current output. Enabled when LDEN1 = high. 20 GND2 -- -- -- -- Ground. -4- CXA2640ER Pin No. Symbol I/O Pin voltage DC AC Equivalent circuit Description DVD output control. (positive logic) When LDEN1 = high, the current set at IIN1 is output through LDOUT1. CD output control. (positive logic) When LDEN2 = high, the current set at IIN1 is output through LDOUT2. 21 LDEN1 I -- -- 21 22 200k 300 22 LDEN2 I -- -- 300 23 OSCEN I -- -- 23 Modulator control. (positive logic) Outputs modulator waveform when OSCEN = high. 24 GND1 -- -- -- -- Ground. -5- CXA2640ER Electrical Characteristics No. 1 2 Measurement item Current consumption 1 Current consumption 2 Symbol Icc1 Icc2 Min. Typ. Max. 10 86 16 22 Unit mA mA (Vcc = 5V, Ta = 25C) Condition LDEN1, 2 = L LDEN1 (2) = H, IOUT1 = 60mA, OSCEN = H, AMP = 40mAp-p LDEN = H, IOUT1 = 60mA, IOUT2 = 120mA (Duty = 25%), IOUT3 = 60mA (Duty = 50%), IOUT = IOUT1 + IOUT2 + IOUT3 LDEN = H, IOUT1 = 30mA, IOUT2 = 120mA (Duty = 25%), IOUT3 = 60mA (Duty = 50%), IOUT = IOUT1 + IOUT2 + IOUT3 123 160 3 Current consumption 3 Icc3 128 183 238 mA 4 Current consumption 3-1 Icc3_1 100 144 188 mA GND -- 0.8 0.2 100 250 250 300 300 350 -- -- 14 OFFSET2 -- -- 4 mA 15 NOISE1 -- 1.5 -- f = 400MHz, ILD = 35mA, nA/Hz Imod = 40mAp-p (20MHz: NOISE) f = 400MHz, ILD = 35mA, nA/Hz Imod = 20mAp-p (20MHz: NOISE) 16 NOISE2 -- 1.5 -- 19 Fall time (Tf) TF -- -6- 1.5 -- ns CXA2640ER No. 20 21 22 23 24 25 Measurement item Input resistance 1 (Pin 7) Input resistance 2 (Pins 8, 9) Input/output gain 1 Input/output gain 2, 3 (DVD) Input/output gain 2, 3 (CD) ILD control linearity 1 (DVD) Symbol ZIINR ZIINW GAINR Min. Typ. Max. 0.56 0.8 1.04 1.05 1.5 1.95 95 105 115 440 935 2.5 Unit k k -- -- -- % Condition GAINW1 360 400 GAINW2 765 840 LINEA1 -3.5 -- Based on linearity when ILD = 50 to 150mA Vcc = 4.5V, VI = 1.75V, RL = 5, ILD = 250mA Based on linearity when ILD = 50 to 150mA Vcc = 4.5V, V2 = 1V, RL = 5, ILD = 300mA 26 ILD control linearity 2 (CD) Input/output gain relative precision Input/output transmission band LINEA2 -3.5 -- 2.5 % 27 28 GACCU FBAND -5 7 -- -- 5 -- % MHz Frequency for input/output gain of -3dB -- ppm/C fmod = 300MHz 42 mAp-p fmod = 400MHz, fmod = 300MHz, RAMP = 10k -- ppm/C -- -- ns ns OSCRES1 -- OSCRES2 -- 38 LDEN response time 1 (OFF) RLDRES2 -- -- 10 ns 39 LDEN response time 2 (ON) WLDRES1 -- -- 700 ns 40 LDEN response time 2 (OFF) WLDRES2 -- -- 10 ns -7- CXA2640ER Electrical Characteristics Measurement Circuit VCC 1 22 GND 6.8k 6.8k 1 22k 11k 11k 18 17 16 15 14 13 VCC_LD RAMP2 RAMP1 R FREQ COMP R FREQ2 R FREQ1 V1 5 5 LDOUT2 12 V2 19 LDOUT1 20 GND2 VCC2 11 1 21 LDEN1 VCC1 10 1 22 LDEN2 IIN3 9 1 23 OSCEN IIN2 8 1 OUTEN2 OUTEN3 24 GND1 OUTENREF xOUTEN2 xOUTEN3 IIN1 7 1 100 2 3 100 4 5 1 VBG 1 6 1 -8- CXA2640ER Description of Operation (1) LD Drive Current Value Setting The current controlled by the current setting pins IIN1, IIN2 and IIN3 is output from the LDOUT1 and LDOUT2 pins. IIN1, IIN 2 and IIN3 can be set respectively by LDEN1, LDEN2, OUTEN and xOUTEN for the output drive current from the LDOUT pin. (2) Differential Input and Single-end Input External processing is required for the differential input and single-end input switching. For the single-end input, if the device is used at the active Low, the OUTENREF pin and the OUTEN pin should be shorted externally; if it is used at the active High, the OUTENREF pin and the xOUTEN pin should be shorted externally. Leave the OUTENREF pin open for the differential input. (3) Modulator Circuit The modulator ON/OFF is controlled by the OSCEN pin. For the DVD side, the modulator frequency is varied by the external resistor connected to the RFREQ1 pin and the modulator amplitude can be varied by the external resistor value connected to the RAMP1 pin. For the CD side, the modulator frequency is varied by the external resistor connected to the RFREQ2 pin and the modulator amplitude can be varied by the external resistor value connected to the RAMP2 pin. (4) RFREQ COMP Pin The current depending on the internal resistor is generated using the RFREQ COMP pin external resistor to suppress the dispersion of the modulator frequency depending on the internal resistor. The RFREQ COMP pin external resistor is recommended to be fixed to 22k. (5) Modulator Level Adjustment The modulator level adjustment can be performed by varying the IIN1 input current value. Modulator OFF Imod - Modulator amplitude [Ap-p] Modulator amplitude Modulator level adjustment Iread - Output drive current [A] Imod Modulator level [Ap-p] Iread 0 IIN1 - Input current [A] RAMP resistance value [] IIN1 input current [A] 1/2Imod Iread = IIN1 x 104 Imod RAMP pin voltage (1.26V) RAMP external resistance value x 200 Iread < 1/2Imod Iread < 1/2Imod -9- CXA2640ER Description of Functions 1. Logic table Output control LDEN1 L H H H H L L L L H LDEN2 L L L L L H H H H H xOUTEN2 xOUTEN3 X H L H L H L H L X X H H L L H H L L X OSCEN X L L L L L L L L X LDOUT1 (DVD) OFF 100 x IIN1 OFF OFF LDOUT2 (CD) 100 x IIN1 + 400 x IIN2 OFF 100 x IIN1 + 400 x IIN3 OFF 100 x IIN1 + 400 x IIN2 OFF + 400 x IIN3 OFF OFF OFF OFF OFF (inhibit) 100 x IIN1 100 x IIN1 + 840 x IIN2 100 x IIN1 + 840 x IIN3 100 x IIN1 + 840 x IIN2 + 800 x IIN3 OFF (inhibit) Module control LDEN1 L H H L L H LDEN2 L L L H H H xOUTEN2 xOUTEN3 X X X X X X X X X X X X OSCEN X L H L H X OFF MODOFF MODON (Rfreq1, Ramp1) OFF OFF OFF (inhibit) LDOUT1 OFF OFF OFF MODOFF MODON (Rfreq2, Ramp2) OFF (inhibit) LDOUT2 Note: Module control does not depend on a data timing signals. - 10 - CXA2640ER 2. Timing Chart (DVD side) LDOUT1 LDEN1 LDEN2 OSCEN OUTEN2 xOUTEN2 OUTEN3 xOUTEN3 (CD side) LDOUT2 LDEN1 LDEN2 OSCEN OUTEN2 xOUTEN2 OUTEN3 xOUTEN3 - 11 - CXA2640ER Notes on Operation * Arrange the external resistors connected to the IIN1, IIN2 and IIN3 pins near the IC package to reduce the affects from other signal lines. * Wiring between the output LDOUT pin and the laser diode, and wiring between the Vcc_LD pin and external decoupling capacitors should be the shortest. Making the distance for wiring long increases output waveform overshoots and undershoots caused by the affect of wiring inductance. * The Vcc_LD pin's external decoupling capacity ground can be grounded to the GND grounding the load from the LDOUT pin. This reverses the phase of the drive waveform at the LDOUT and Vcc_LD and moves in the direction that suppresses overshoots and undershoots. * Temperature guarantee Thermal resistance (j-a) when the CXA2640ER is mounted on PWB varies according to the set (PWB) and because it is difficult to predict along with the tendency for higher power for power consumption (Po), the following points should be considered when using. Use in a range that does not exceed a junction temperature of 150C. Also, power consumption (PO) should be below allowable power dissipation (PD). Use with the thermal resistance (j-a) of the PWB mounting lowered so that it can be operated normally at a maximum operating temperature of 75C. To lower j-a, radiating measures on the set, such as widening the GND region with the set PWB are needed. Also, the diepad on the CXA2640ER 24-pin VQFN package is exposed on the backside, so thermal transmission from the IC backside to the PWB is excellent. For that reason, it is possible to release heat from the PBC to the set chassis thereby lowering the thermal resistance of the PWB mount. Find the thermal resistance (j-a) when mounted on PWB and power consumption (PO) using the following method. Po = (Icc x Vcc) - (Iop x Vop) Icc: IC current consumption when operating (Including Iop) Iop: Output drive current flowed from the LDOUT pin to the Laser Diode Vop: Operating voltage of the laser diode It is also possible for Po when a modulator is ON (Imod = 40mAp-p), although the precision will decrease. On the DVD side: Po = (50mA + IIN1 x 2.6 + (IIN2 + IIN3) x 10) x VCC + (Iop x (Vcc - Vop)) On the CD side: Po = (50mA + IIN1 x 2.6 + (IIN2 + IIN3) x 21) x VCC + (Iop x (Vcc - Vop)) - 12 - CXA2640ER Thermal resistance (j-a) when mounted on PWB * The thermal resistance (c-a) is obtained by measuring the Package surface temperature using a thermo couple or a radiation thermometer. In order to improve the precision of measurement, it is desired to calculate by the following formula. Package surface temperature when Iop is variable/Po Assume the thermal resistance (j-c) to be approximately 2C/W. * Diode thermal coefficient -2.27mV/C and the positive protection diode thermal characteristics are used to find this. The V2 voltage found in (2) below cancels the voltage decrease caused by the wiring resistance between the positive protection diode connection Vcc and the Vcc pins as reference and is measured to find the precise temperature characteristics of the positive protection diode. (1) V1 to OSCEN pin voltage to Vcc pin voltage, Icc1 to current consumption when 0V is applied to the IIN1, IIN2 and IIN3 pins. (2) V2 to OSCEN pin voltage to Vcc pin voltage immediately after applying the arbitrary voltage to the IINx pin. (3) V3 to OSCEN pin voltage to Vcc pin voltage, Icc3 to consumption current when applying the arbitrary voltage to the IINx pin and heat reaches equilibrium. Tj using the voltage drop (V1 to V2) between the positive protection diode connection Vcc and the Vcc pins that are the reference, as described above are: Tj = ((V3 + (V1 - V2)) - V1)/-2.27mV/C Thermal resistance (j-a) is: j-a = Tj/((Icc3 - Icc1) x Vcc - Iop x Vop) * Allowable power dissipation (PD) PO [W] PD = (150C - Ambient temperature)/j-a * Maximum operating temperature (150C - Tj) 75C VCC 23 OSCEN VCC Pin voltage measurement point 1M 10V 5V 11 5V GND 5V - 13 - CXA2640ER Example of Representative Characteristics IIN1 input current vs. CD/DVD output current characteristics Vcc = 5V, resistance load 120 400 350 IIN2/3 input current vs. CD/DVD output current characteristics Vcc = 5V, resistance load 100 CD/DVD output current [mA] CD/DVD output current [mA] 300 250 200 150 100 50 80 CD DVD 60 CD DVD 40 20 0 0 200 400 600 800 1000 1200 IIN1 input current [A] 0 0 100 200 300 400 500 600 700 800 IIN2/3 input current [A] Modulator frequency control characteristics RAMP = 3.3k (approximately 40mAp-p) RFREQ_COMP = 22k, IIN1 = 642A 800 RAMP resistance value vs. modulator waveform peak current characteristics RFREQ = 12k (approximately 390MHz) RFREQ_COMP = 22k, IIN1 = 642A 80 Modulator peak to peak current [mAp-p] 20 25 700 70 60 50 40 30 20 10 0 Modulator frequency [MHz] 600 500 400 300 200 100 0 0 5 10 15 RFREQ resistance [k] 0 2 4 6 8 10 12 RAMP resistance value [k] - 14 - CXA2640ER Application circuit 1 Timing Control Logic LVDS/LVPECL 100 0.1 0.1 100 OUTENREF xOUTEN3 xOUTEN2 OUTEN3 6 7 IIN1 5 4 3 2 1 24 OUTEN2 VBG GND1 Voltage DAC IIN2 8 23 OSCEN IIN3 9 22 LDEN2 10 Vcc1 1 11 1 Vcc2 12 13 14 15 16 17 18 21 LDEN1 20 GND2 19 LDOUT1 LD1 LDOUT2 LD2 R FREQ COMP R FREQ1 R FREQ2 RAMP1 Vcc_LD 1 10k 10k 6.2k 6.2k Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 15 - RAMP2 Mode Control Logic CMOS 3.3/TTL CXA2640ER Application circuit 2 Timing Control Logic CMOS 3.3/TTL 0.1 0.1 OUTENREF xOUTEN3 xOUTEN2 OUTEN3 6 7 IIN1 Voltage DAC 5 4 3 2 1 24 OUTEN2 VBG GND1 Mode Control Logic CMOS 3.3/TTL IIN2 8 23 OSCEN IIN3 9 22 LDEN2 10 Vcc1 1 11 1 Vcc2 12 13 R FREQ1 21 LDEN1 20 GND2 19 LDOUT1 14 R FREQ2 LDOUT2 LD2 15 R FREQ COMP 16 Vcc_LD 17 RAMP1 18 RAMP2 LD1 1 10k 10k 6.2k 6.2k Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. - 16 - CXA2640ER Package Outline Unit: mm 24PIN VQFN(PLASTIC) 4.0 3.6 C 13 0.7 0.9 0.1 2.0 0.6 0.1 0.05 S 18 19 A 12 B 4R 0. 3 9) .3 (0 45 PIN 1 INDEX 24 7 1 6 0.4 x4 0.1 S A-B C x4 0.1 S A-B C 0.05 M S A-B C S C 0. 6 0.03 0.03(1) (Stand Off) Solder Plating 0.13 0.025 + 0.09 0.14 - 0.03 TERMINAL SECTION NOTE: 1) The dimensions of the terminal section apply to the ranges of 0.1mm and 0.25mm from the end of a terminal. 2) The dimension of (1) is apply to DiePad and the lead. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE VQFN-24P-04 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.04g LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m 0.2 0.01 0.225 0.03 (0 .1 5) 1.0 - 17 - Sony Corporation |
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